Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...

COLUMBUS, Ohio--(BUSINESS WIRE)--FastRTM, a project of an industry consortium supported by IRT M2P, focused on enabling composite mass production, used a specialty epoxy resin system from Hexion Inc. ...

The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...

While semiconductors tend to capture people’s attention far more than their packaging, a die and its packaging are inseparable. The success of a device — especially an RF or microwave device — often ...