The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the ...
Ball grid array (BGA) reworking typically involves de-soldering and resoldering the chip to remove defective components and mount new ones. However, it’s a complex task, and people can easily make ...
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