Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain by leveraging one of the few areas where it still holds a differentiated ...

When investors think about AI winners, the usual names come to mind: Nvidia (NVDA), TSMC, or memory makers like Micron (MU).

MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the ...

TSMC Senior VP Kevin Zhang says energy efficiency, not raw computing power, is reshaping AI chip design and your portfolio.

AMD's investments will focus on partnerships with companies to "advance" chip packaging and manufacturing required for ...

By Wen-Yee Lee TAIPEI, May 29 (Reuters) - Taiwan chip designer MediaTek said on Friday it supports both TSMC's and Intel's ...

TAIPEI, June 2, 2026 — Dow (NYSE: DOW) will showcase thermal management materials designed to address the escalating heat and ...

By Toby Sterling ANTWERP, Belgium, May 20 (Reuters) - The booming global semiconductor market will be "tense" with tight ...

CPUs act like the brain of the computer, and more will be needed to handle the sequential reasoning and tools required to manage AI agents. While AI training typically has an 8-to-1 GPU-to-CPU ratio, ...