Taiwan Semiconductor Manufacturing (TSMC) said it plans to open an advanced chip packaging facility in Arizona by 2029, ...

Taiwan Semiconductor Manufacturing Co. plans to open an advanced chip packaging plant in Arizona by 2029, expanding its U.S.

The facility will use advanced packaging technologies to combine multiple chips into single packages for AI applications.

Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National ...

Union City just scored a serious upgrade in the tech world. Japanese materials firm Resonac has opened what industry and ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the ...

A ribbon-cutting ceremony of a new advanced semiconductor research and development center in Union City marks the first such ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

Launched in 2021 with a Rs 76,000-crore outlay, the India Semiconductor Mission was conceived as a state-backed push to build ...

SK Hynix announces $13B South Korea plant for HBM chip packaging targeting AI data centers, with construction starting April ...

Intel (INTC) has been derided for squandering its leadership position in the chip race while also not leveraging its capabilities fully as a full-stack provider of everything semiconductors. No wonder ...

As artificial intelligence demand drives the global semiconductor industry toward a trillion-dollar scale in 2026, three ...